WaferClean 3600

Image of the WaferClean 3600



The Eco-Snow WaferClean 3600 System removes particulate contamination, post-etch veils and fences, and thin-film organic residues from 200 or 300mm wafer substrates using our unique carbon dioxide (CO2) snow cleaning process.
Eco-Snow WaferClean 3600 cleaning is a fast, environmentally friendly, "all-dry", non-contact process that offers numerous advantages over conventional cleaning systems:

  • Superior cleaning performance
  • Reduced cycle times
  • Small footprint
  • Low cost of ownership

Request Information on this product